| Property/Requirement | Immersion Gold (ENIG) | Immersion Silver (Ag) | Immersion Tin (Sn) | OSP | LF-HASL | HASL (Tin Lead) |
| Cost | High | Medium | Medium | Lowest | Low | Low |
| Estimated Shelf Life (15-28°c) | 12 months | 6 months | 6 months | 3-6 months | 12 months | 12 months |
| Thermal Shock (PCB MFG) | Low | Very Low | Very Low | Very Low | High | High |
| Wetting Performance | Very Good | Good | Good | Low | Best | Best |
| Solder Paste Printing (fine pitch) | Excellent | Excellent | Excellent | Excellent | Good | Good |
| Integrity/Reliability Of Solder Joint | Best | Good | Good | Good | Best | Best |
| Al. Wire Bonding (can be used with) | Yes | Yes | No | No | No | No |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
