| Primary Materials | Typical Tg Value (DSC) | Common Application | Material Example |
| Polyimide | N/A | All applications | Shengyi SF305 |
| Feature | Parameter (in) | Parameter (mm) |
| Layers | 1 – 6 | 1 – 6 |
| Max Board Size | 20” x 20” | 508 x 508mm |
| Min Board Thickness – 1-2 (layers) | 6mil | 0.15mm |
| Min Board Thickness – 1-2 (layers) | 8mil | 0.2mm |
| Min Board Thickness – 6 (layers) | 10mil | 0.25mm |
| Board Thickness Range | 6 – 25mil | 0.15 – 0.63mm |
| Max Copper Thickness | 2oz | 70um |
| Min Line Width / Space | 2mil / 2mil | 0.05 / 0.05mm |
| Min Hole Size | 3mil | 0.075mm |
| PTH Dia. Tolerance | ±2mil | ±0.05mm |
| NPTH Dia. Tolerance | ±1mil | ±0.025mm |
| ±4mil | ±0.1mm | |
| Outline Tolerance | ±3mil | ±0.075mm |
| S/M Pitch | 3mil | 0.075mm |
| Aspect Ratio | 6:1 | 6:1 |
| Thermal Shock | 5 x 10Sec @288 | 5 x 10Sec @288 |
| Flammability | 94V-0 | 94V-0 |
| Impedance Control | ±5% | ±5% |
