| Feature | Parameter (in) | Parameter (mm) |
| Layers – Flex | 1 – 4 | 1 – 4 |
| Layers – Rigid | 4 – 30> | 4 – 30> |
| Max Board Size | 24” x 40” | 609.6 x 1016mm |
| Min Board Thickness – 1-2 (layers) | 14mil | 0.35mm |
| Min Board Thickness – 4 (layers) | 16mil | 0.4mm |
| Min Board Thickness – 6 (layers) | 16mil | 0.4mm |
| Min Board Thickness – 8 (layers) | 16mil | 0.4mm |
| Min Board Thickness – 10 (layers) | 32mil | 0.8mm |
| Min Board Thickness – 12 (layers) | 40mil | 1.0mm |
| Min Board Thickness – 14 (layers) | 48mil | 1.2mm |
| Min Board Thickness – 16 (layers) | 54mil | 1.4mm |
| Min Board Thickness – 18 (layers) | 62mil | 1.6mm |
| Min Board Thickness – >20 (layers) | 62mil | 1.6mm |
| Board Thickness Range | 14 – 276mil | 0.35 – 7mm |
| Max Copper Thickness | 5oz | 175um |
| Min Line Width / Space | 2mil / 2mil | 0.05 / 0.05mm |
| Min Hole Size | 3mil | 0.075mm |
| PTH Dia. Tolerance | ±2mil | ±0.05mm |
| NPTH Dia. Tolerance | ±1mil | ±0.025mm |
| Hole Position Deviation | ±3mil | ±0.075mm |
| Outline Tolerance | ±4mil | ±0.1mm |
| S/M Pitch | 3mil | 0.075mm |
| Aspect Ratio | 18:1 | 18:1 |
| Thermal Shock | 5 x 10Sec @288 | 5 x 10Sec @288 |
| Warp & Twist | <= 0.7% | <= 0.7% |
| Flammability | 94V-0 | 94V-0 |
| Impedance Control | ±5% | ±5% |
| HDI Capability | 3+N+3 | 3+N+3 |
